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Redux 322U Modified Epoxy Film Adhesive (300g/m2 Areal Weight) 5SqMt (Freezer Storage -18C) | HEXCEL COMPOSITES
Redux 322 is a high performance modified epoxy film adhesive curing at 175C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220C for short periods, or 200C for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.
Redux 322U Modified Epoxy Film Adhesive (300g/m2 Areal Weight) 5SqMt (Freezer Storage -18C), Redux 322 is a high performance modified epoxy film adhesive curing at 175C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220C for short periods, or 200C for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.
| Large Part Description | Redux 322 is a high performance modified epoxy film adhesive curing at 175C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220C for short periods, or 200C for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content. |
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| Part Number | Redux 322U Modified Epoxy Film Adhesive (300g/m2 Areal Weight) 5SqMt (Freezer Storage -18C) |
| Featured Brands | HEXCEL COMPOSITES |
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