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Redux 312 Modified Epoxy Film Adhesive in various sizes | HEXCEL COMPOSITES
Redux 312 is a high strength 120C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 100C may be experienced.
Redux 312 Modified Epoxy Film Adhesive in various sizes, Redux 312 is a high strength 120C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 100C may be experienced.
| Large Part Description | Redux 312 is a high strength 120C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 100C may be experienced. |
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| Part Number | Redux 312 Modified Epoxy Film Adhesive in various sizes |
| Featured Brands | HEXCEL COMPOSITES |
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