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Redux 312/5 Modified Epoxy Film Adhesive in various sizes | HEXCEL COMPOSITES
Redux 312 is a high strength 120C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 100C may be experienced. A supported version, Redux 312/5, is available with a woven nylon carrier for bond line thickness control.
Redux 312/5 Modified Epoxy Film Adhesive in various sizes, Redux 312 is a high strength 120C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 100C may be experienced. A supported version, Redux 312/5, is available with a woven nylon carrier for bond line thickness control.
| Large Part Description | Redux 312 is a high strength 120C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 100C may be experienced. A supported version, Redux 312/5, is available with a woven nylon carrier for bond line thickness control. |
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| Part Number | Redux 312/5 Modified Epoxy Film Adhesive in various sizes |
| Featured Brands | HEXCEL COMPOSITES |
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