Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit | PARKER-HANNIFIN CORP-CHOMERICS DIV

Cho-Bond 360-20 Electrically Conductive Epoxy Adhesive 1Lb Kit | PARKER-HANNIFIN CORP-CHOMERICS DIV

Cho-Bond 584-208 Epoxy Adhesive in various sizes | PARKER-HANNIFIN CORP-CHOMERICS DIV

Cho-Bond 584-208 Epoxy Adhesive in various sizes | PARKER-HANNIFIN CORP-CHOMERICS DIV

Cho-Bond 360-208 Epoxy Adhesive Caulk 3oz Kit | PARKER-HANNIFIN CORP-CHOMERICS DIV

Adhesive/sealant uses a filler blend of pure silver and silver-plated-copper particles to produce superior shielding performance without requiring contact pressure, making it an ideal fillet seal. Its low flow properties make it the material of choice for vertical and overhead fillets.
Cho-Bond 360-208 Epoxy Adhesive Caulk 3oz Kit, Adhesive/sealant uses a filler blend of pure silver and silver-plated-copper particles to produce superior shielding performance without requiring contact pressure, making it an ideal fillet seal. Its low flow properties make it the material of choice for vertical and overhead fillets.
More Information
Large Part Description Adhesive/sealant uses a filler blend of pure silver and silver-plated-copper particles to produce superior shielding performance without requiring contact pressure, making it an ideal fillet seal. Its low flow properties make it the material of choice for vertical and overhead fillets.
Part Number Cho-Bond 360-208 Epoxy Adhesive Caulk 3oz Kit
Featured Brands PARKER-HANNIFIN CORP-CHOMERICS DIV
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