We use cookies to make your experience better. To comply with the new e-Privacy directive, we need to ask for your consent to set the cookies. Learn more.
Did you find what you came looking for?
Let us help you with what you need. Leave a message and we’ll get back to you with the solution to all your industrial problems
Cho-Bond 584-208 Epoxy Adhesive in various sizes | PARKER-HANNIFIN CORP-CHOMERICS DIV
Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212F (100C), the material offers volume resistivity of 0.005 ohm-cm.
Cho-Bond 584-208 Epoxy Adhesive in various sizes, Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212F (100C), the material offers volume resistivity of 0.005 ohm-cm.
| Large Part Description | Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212F (100C), the material offers volume resistivity of 0.005 ohm-cm. |
|---|---|
| Part Number | Cho-Bond 584-208 Epoxy Adhesive in various sizes |
| Featured Brands | PARKER-HANNIFIN CORP-CHOMERICS DIV |
Write Your Own Review